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博通今天的财报电话会议（北京时间2026年3月5日凌晨）问答环节节选（有关CPO的部分）
英文原文+中文翻译
Tom O'Malley(Barclays): Hey, guys. Thanks for taking my questions. I have one for Hock and one for Charlie. I know you are very specific and particular about what you put in the preamble, and you noted that customers are staying at direct attached copper through 400G SerDes. Is there any reason you are pointing that out in particular, especially as a leading pioneer in CPO? And then on Charlie's side, as you are adding more customers here, I would imagine customers with design ASICs with you are going to use scale-up Ethernet. Maybe talk about scale-up protocols and how you see Ethernet developing there as well.
Hock Tan(Broadcom CEO): Okay. No. I am just highlighting the fact that we do—on networking—our technology is really very, very uniquely positioned to help our customers, and more than our customers, even customers using general purpose GPUs, not just XPUs. If you are trying to create LLMs, and creating your own AI data centers and redesigning it—architecting it—you truly want larger and larger domains or clusters, and you really want to connect XPU to XPU directly where you can. And the best way to do that is to use direct attached copper. That is the lowest latency, lowest power, and lowest cost. So you want to keep doing that, especially in scale up, as long as possible.
In scaling out, we are fine with optical. But I am talking about scaling up in a rack—a cluster domain—you really want to use direct attached copper as long as you can. And we are still, based on our technology that Broadcom has, especially on connecting XPU to XPU or even GPU to GPU, able to do it with copper. And we can push the envelope from 100G to 200G to even to 400G. We have SerDes now running 400G that can drive distance on a rack to run copper. All I am trying to say is you do not need to go run into some bright shiny object called CPO.
Even as we are the lead in CPO, CPOs will come in its time. Not this year, maybe not next year. But in its time.
汤姆·奥马利（巴克莱银行）：嘿，伙计们。感谢你们回答我的问题。我有一个问题想问霍克，还有一个问题想问查理。我知道你们对于序言中的内容非常具体和挑剔，而且你们指出客户正在使用直接连接的铜线实现 400G SerDes。你们特别指出这一点是否有原因，尤其是作为 CPO 领域的领先先驱？至于查理那边，随着你们吸引到更多客户，我猜想那些与你们合作设计 ASIC 的客户会使用可扩展以太网。也许可以谈谈可扩展协议以及你们如何看待以太网在此方面的未来发展。
霍克·谭（博通公司首席执行官）：好的。不，我只是想强调一个事实：在 networking 领域，我们的技术确实处于非常独特的地位，能够帮助我们客户，甚至超越我们的客户，帮助那些使用通用 GPU（而非 XPU）的客户。如果你试图创建 LLM，构建自己的 AI 数据中心并进行重新设计——即进行架构设计——那么你确实需要更大的领域或集群，而且你确实希望尽可能地将 XPU 直接连接起来。实现这一目标的最佳方式就是使用直接连接的铜线。这种方式具有最低的延迟、最低的功耗和最低的成本。因此，你希望尽可能长时间地继续这样做，尤其是在规模扩大的情况下。
在横向扩展方面，我们接受使用光学技术。但我所谈论的是在机架层面——集群领域——的纵向扩展。只要可能，你真的希望使用直接连接的铜线。基于博通公司的技术，尤其是将 XPU 连接至 XPU 或甚至将 GPU 连接至 GPU 的技术，我们仍然能够使用铜线来实现这一目标。我们能够将传输速率从 100G 提升至 200G，甚至 400G。目前，我们的 SerDes 技术已经实现了 400G 的传输速率，能够在机架内驱动铜线传输。我想说的是，你不需要去尝试使用某种名为 CPO 的闪亮物件。
尽管我们目前在 CPO 领域处于领先地位，但 CPO 的发展尚需时日。或许今年不会，或许明年也不会。但终有一天它会到来。
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